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Adhesives Technology for Electronic ApplicationsAdhesives, Sealants and Coatings for the Electronics Industry
Advanced Cleaning Product Formulations Database
Advanced Polymer Processing Operations
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Chemical Resistance, Volume 1
Chemical Resistance, Volume 2
Coating Materials for Electronic Applications
Coloring Technology for Plastics
Conductive Polymers and Plastics in Industrial Applications
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Database of Antiblocking, ReleaseDeveloping and Managing Engineering Procedures
Diamond Films and Coatings
Diffusion Processes in Advanced Technological Materials
Dynamic Mechanical Analysis for Plastics Engineering
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Electrically Conductive Organic Polymers for Advanced ApplicationsEngineering Problem Solving: A Classical Perspective
Epoxy Resins, Curing Agents, Compounds, and Modifiers, Second Edition
Extrusion: The Definitive Processing Guide and Handbook
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Failure of Plastics and Rubber ProductsFatigue and Tribological Properties of Plastics and Elastomers
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Film Properties of Plastics and Elastomers, 2nd Edition
Fluorinated Coatings and Finishes Handbook
Fluoroelastomers Handbook: The Definitive Users Guide and Databook
Fluoroplastics, Volume 1: Non-Melt Processible Fluoroplastics
Fluoroplastics, Volume 2: Melt-Processible Fluoroplastics
Fluoropolymer Applications in Chemical Processing Industries: The Definitive Users Guide and Databook
Fuel Cells Durability: Stationary, Automotive, Portable - 1st Edition
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Handbook of Antiblocking, Release, and Slip AdditivesHandbook of Chemical Vapor Deposition, Second Edition
Handbook of Deposition Technologies for Films and Coatings, 2nd Edition
Handbook of Environmental Degradation of Materials
Handbook of Fillers, 2nd Edition
Handbook of Material Weathering, 3rd Edition
Handbook of Mold, Tool and Die Repair Welding
Handbook of Molded Part Shrinkage and Warpage
Handbook of Plasma Processing Technology
Handbook of Plastic Foams
Handbook of Plasticizers
Handbook of Plastics Joining
Handbook of Solvents
Handbook of Thermoset Plastics, Second Edition
Handbook of Thin Film Deposition Processes and Techniques, 2nd Edition
Handbook on Basics of Coating Technology
Hermeticity of Electronic Packages
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Imaging and Image Analysis Applications for PlasticsIndexing: A Nuts-and-Bolts Guide for Technical Writers
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Mechanical Alloying for Fabrication of Advanced Engineering MaterialsMedical Plastics—Degradation, Resistance & Failure Analysis
Metallocene Catalyzed Polymers
Metallocene Technology in Commercial Applications
Mixed Plastics Recycling Technology
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Nanostructured MaterialsP
Paint & Ink Formulations DatabasePaint and Surface Coatings, 2nd Edition
Permeability Properties of plastics and elastomers
Plasticizers Database
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Plastics Additives, Volume 1
Plastics Additives, Volume 2
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Plastics Failure Analysis and Prevention
Polymers from Biobased Materials
Polypropylene: The Definitive Users Guide and Databook
Powder Coatings Chemistry and Technology
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Reactive Polymers Fundamentals and Applications: A Concise Guide to Industrial PolymersRheology: Concepts, Methods and Applications
Rotational Molding Technology
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Single Sourcing: Building Modular DocumentationSmall Fuel Cells for Portable Applications 6th Edition
Sol-Gel Technology for Thin Films, Fibers, Preforms, Electronics and Specialty Shapes
Solvents Database
Specialized Molding Techniques—Application, Design, Materials and Processing
Surface Preparation Techniques for Adhesive Bonding
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The Effect of Creep and Other Time Related Factors on Plastics and ElastomersThe Effect of Sterilization Methods on Plastics and Elastomers, 2nd Edition
The Effect of Temperature and Other Factors on Plastics
The Effect of UV Light and Weather on Plastics and Elastomers
The Rheology Handbook
The Rubber Formulary
Thin Film Materials Technology: Sputtering of Compound Materials
Tufted Carpet: Textile Fibers, Dyes, Finishes and Processes
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Water-Soluble Resins, Second EditionWeathering of Plastics
Hermeticity of Electronic Packages
Author
Hal GreenhousePrices
List price: 159,00 US$Please ask for recent prices in Euro and shipping costs.
Language
enCategory
PackagingAudience
Essentials of hermeticity technology for package engineers, scientists and technicians as well as novice users, package designers, reliability engineers and those who measure and evaluate the integrity of packages, especially in the field of microelectronics.Features
- Brings together in a single resource virtually every issue involving hermeticity, including material based on the authors long experience.
- Written for novices as well as scientists, engineers and technicians with experience in the field.
- Contains scores of graphs for solving problems and explaining mathematical relationships.
- Includes nearly 100 common hermeticity problems encountered on the job, along with their solutions.
Description
This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package—especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities.Non-specialists in particular will benefit from the authors long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise.
The book gathers in a single volume a great many issues previously available only in journals—or only in the experience of working engineers. How to define the "goodness" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.
Content
Content
About the author
Hal Greenhouse worked for many years at the Bendix Aviation Corporation in Baltimore, MD. His career there began in 1959 in hybrid microcircuit technology in the Bendix Radio Division and the development of thin film technology for use in hybrid microcircuits. He was instrumental in the building of a thick film hybrid microcircuit facility in 1980 and lead designer of over a dozen high reliability hybrid microcircuits for a missile system as well as the design of over 100 hybrid microcircuits and multi chip modules. The author has published a score of papers and 5 patents, one of which is basic and issued in over 20 countries. He is a member of numerous professional societies.Copyright
1999Specs
Pages: 4006 x 9, Hardcover