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Adhesives Technology for Electronic Applications

Author

James J. Licari, Dale W. Swanson

Prices

List price: 165,00 US$

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Language

Audience

Elektro- und Materialentwickler in der Medizinechnik, der Automobil-, Halbleiter-, Raumfahrt-, Kunstoff- und Rüstungsindustrie.

Description

This second book in the Materials and Processes for Electronic Applications Series (James J. Licari, ed.) is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Each book in the Materials and Processes for Electronic Applications Series provides theoretical foundations and practical data useful to electronics design engineers, process engineers, manufacturing engineers, quality assurance and reliability engineers, materials scientists, and polymer chemists as they strive to achieve ever more demanding electronics products features. These interdisciplinary books bridge gaps between electronics engineers and materials engineers important to advancing the state of the art. Applications cover the major industries: automotive, medical, semiconductors, space, and military.

Content

About the author

James J. Licari is President of AvanTeco, Whittier, CA, and a consultant on materials and processes for microelectronics. Prior to this, he was Chief Scientist for Hughes Microelectronics Division in Newport Beach, CA, where he led the development of high-density, high-performance multichip modules for high reliability military and space applications. Dr. Licari is internationally recognized for his contributions to the microelectronics field, particularly in the development of materials and processes for interconnecting and packaging hybrid microcircuits and multichip modules. He is the recipient of six NASA awards, the annual Technical Achievement Award from IMAPS, and the Materials Engineer of the Year Award from NEPCON. Licari is also the author of four books and over 100 publications and has lectured at UCLA, Jet Propulsion Laboratories, and Oxford University, among others.

Dale W. Swanson is an Engineering Specialist in the Materials and Processes Laboratory at Boeing Integrated Defense Systems in Anaheim, California. Mr Swanson has over 20 years experience in materials and process engineering for electronic applications including printed-wiring boards, hybrid microcircuits and multichip modules, reliability for single-chip integrated-circuit packaging, and specialty applications such as rapid in-line curing for high-throughput surface-mount applications. Mr. Swanson has authored more than 20 technical publications and white papers. He was inducted into the Boeing Technical Fellowship in 2001 as an Associate Technical Fellow for adhesives in electronic applications.

Copyright

2005

Specs

Pages: 350

6 x 9, Hardcover

ISBN

0-8155-1513-8

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