A
Adhesives Technology for Electronic ApplicationsAdhesives, Sealants and Coatings for the Electronics Industry
Advanced Cleaning Product Formulations Database
Advanced Polymer Processing Operations
C
Ceramic Films and CoatingsChemical Resistance CD-ROM (3rd Ed.)
Chemical Resistance, Volume 1
Chemical Resistance, Volume 2
Coating Materials for Electronic Applications
Coloring Technology for Plastics
Conductive Polymers and Plastics in Industrial Applications
D
Database of Antiblocking, ReleaseDeveloping and Managing Engineering Procedures
Diamond Films and Coatings
Diffusion Processes in Advanced Technological Materials
Dynamic Mechanical Analysis for Plastics Engineering
E
Electrically Conductive Organic Polymers for Advanced ApplicationsEngineering Problem Solving: A Classical Perspective
Epoxy Resins, Curing Agents, Compounds, and Modifiers, Second Edition
Extrusion: The Definitive Processing Guide and Handbook
F
Failure of Plastics and Rubber ProductsFatigue and Tribological Properties of Plastics and Elastomers
Fiberglass Reinforced Plastics
Film Properties of Plastics and Elastomers, 2nd Edition
Fluorinated Coatings and Finishes Handbook
Fluoroelastomers Handbook: The Definitive Users Guide and Databook
Fluoroplastics, Volume 1: Non-Melt Processible Fluoroplastics
Fluoroplastics, Volume 2: Melt-Processible Fluoroplastics
Fluoropolymer Applications in Chemical Processing Industries: The Definitive Users Guide and Databook
Fuel Cells Durability: Stationary, Automotive, Portable - 1st Edition
H
Handbook of Antiblocking, Release, and Slip AdditivesHandbook of Chemical Vapor Deposition, Second Edition
Handbook of Deposition Technologies for Films and Coatings, 2nd Edition
Handbook of Environmental Degradation of Materials
Handbook of Fillers, 2nd Edition
Handbook of Material Weathering, 3rd Edition
Handbook of Mold, Tool and Die Repair Welding
Handbook of Molded Part Shrinkage and Warpage
Handbook of Plasma Processing Technology
Handbook of Plastic Foams
Handbook of Plasticizers
Handbook of Plastics Joining
Handbook of Solvents
Handbook of Thermoset Plastics, Second Edition
Handbook of Thin Film Deposition Processes and Techniques, 2nd Edition
Handbook on Basics of Coating Technology
Hermeticity of Electronic Packages
I
Imaging and Image Analysis Applications for PlasticsIndexing: A Nuts-and-Bolts Guide for Technical Writers
M
Mechanical Alloying for Fabrication of Advanced Engineering MaterialsMedical Plastics—Degradation, Resistance & Failure Analysis
Metallocene Catalyzed Polymers
Metallocene Technology in Commercial Applications
Mixed Plastics Recycling Technology
N
Nanostructured MaterialsP
Paint & Ink Formulations DatabasePaint and Surface Coatings, 2nd Edition
Permeability Properties of plastics and elastomers
Plasticizers Database
Plastics Additives Database
Plastics Additives, Volume 1
Plastics Additives, Volume 2
Plastics Additives, Volume 3
Plastics Failure Analysis and Prevention
Polymers from Biobased Materials
Polypropylene: The Definitive Users Guide and Databook
Powder Coatings Chemistry and Technology
R
Reactive Polymers Fundamentals and Applications: A Concise Guide to Industrial PolymersRheology: Concepts, Methods and Applications
Rotational Molding Technology
S
Single Sourcing: Building Modular DocumentationSmall Fuel Cells for Portable Applications 6th Edition
Sol-Gel Technology for Thin Films, Fibers, Preforms, Electronics and Specialty Shapes
Solvents Database
Specialized Molding Techniques—Application, Design, Materials and Processing
Surface Preparation Techniques for Adhesive Bonding
T
The Effect of Creep and Other Time Related Factors on Plastics and ElastomersThe Effect of Sterilization Methods on Plastics and Elastomers, 2nd Edition
The Effect of Temperature and Other Factors on Plastics
The Effect of UV Light and Weather on Plastics and Elastomers
The Rheology Handbook
The Rubber Formulary
Thin Film Materials Technology: Sputtering of Compound Materials
Tufted Carpet: Textile Fibers, Dyes, Finishes and Processes
W
Water-Soluble Resins, Second EditionWeathering of Plastics
Handbook of Thin Film Deposition Processes and Techniques, 2nd Edition
Author
Krishna SeshanPrices
List price: 160,00 US$Please ask for recent prices in Euro and shipping costs.
Language
enCategory
Diffusion & Thin FilmsAudience
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries.Features
- All-new material on dielectric CVD methods, feature scale modeling, silicon metrology, contamination and contamination control, physical vapor deposition, CMP, and organic dielectrics.
- Guide provides all the information needed to understand new developments and requirements in the field as semiconductors get smaller and smaller.
- Preserves several classic chapters from the first edition showing the fundamentals of growing epitaxial silicon—which have remained the same.
- Chapter on feature scale modeling examines design rules for metal height and spacing to avoid porosity and pinholes that later compromise reliability.
Description
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Content
Content
Copyright
2001Specs
Pages: 4206 x 9, Hardcover